The DEK TQ represents a quantum leap forward. With its completely new design, the new DEK generation is faster, more accurate, more powerful, easier to maintain, and easier to integrate. New drives, off-belt printing and innovative clamping systems ensure unprecedented accuracy and deliver a stable printing process – even for the latest 0201 metric components.

Maximum productivity in a minimum footprint: New three-stage conveyors and unique ASM NuMotion controllers with fiber-optic cabling reduce the core cycle time (CCT) to 5 seconds.

With flexible automation functions and options, such as a high-capacity cleaning fluid tank, automatic paste management and smart pin placement as well as open interfaces, the DEK TQ fits seamlessly into ASMPT’s integrated Open Automation concept and delivers more than 8 hours of continuous operation with no operator assists.

 Maximum flexibility for the integrated smart factory

With its modular and scalable configuration options, the DEK NeoHorizon printer meets any process requirements and offers best flexibility for any production volumes.

 DEK NeoHorizon Innovations

 Best printing offering to cover all your needs

 DEK NeoHorizon 03 iX:

 Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma)

System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma)

Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Certified by external system for every printer before delivery by standard

Core Cycle Time (CCT): 8 sec.

Perfect printing solution for best performance in high-mix production

 DEK NeoHorizon 01 iX:

 Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma)

System Alignment Capability: +/- 15μm @ 2.0 Cmk, (±6 Sigma)

Wet Print Capability: ±20 µm @ 2.0 Cpk, (±6 Sigma) - Certified by external system for every printer before delivery by standard

Core Cycle Time (CCT): 6.5 sec.

Best printing quality with maximum throughput

DEK NeoHorizon Back-to-Back:

 The DEK NeoHorizon Back-to-Back setup offers higher print performance in dual-lane assembly line

 DEK NeoHorizon Options

 DEK provides the industry’s most powerful and flexible printing platforms. The following retrofittable DEK options help you further improve productivity and print quality on your DEK NeoHorizon printer:

 

Full flexible DEK All Purpose Clamping (APC) system

High flexibility and maximum cleaning performance with DEK Typhoon Cleaner

DEK Grid-Lok: the universal board support system

DEK Paste Management: the best combination of automated paste dispensing with paste roll height control

Closed loop to SPI systems with ProDEK

DEK Multiple Alignment of Singulated Substrates (MASS) offers a solution for individual optical alignment at a very high speed to boost your throughput

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SIPLACE SX

Our placement solution for high-mix electronics production

 With the SIPLACE SX, your factory is ready for anything that comes along.

 The SIPLACE SX was designed to be flexible. It is the world’s only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries.

 With the SIPLACE SX we have made our most successful placement solution even better:

 Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily

The SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision

SIPLACE TwinStar: The head for special tasks

SIPLACE MultiStar: Switches between placement modes on demand

ASM Smart Transport Module: Process PCBs with lengths of up to 1.525 meters

LED centering: Align components based on top-side features

Place critical components reliable with the SIPLACE OSC Package

Touchless placement: Maximum placement quality for highly sensitive components

SIPLACE SpeedStar and SIPLACE MultiStar heads can operate jointly in the same placement area for more flexibility and performance.

Minimum placement force: 0.5 N

SIPLACE Smart Pin Support: Automated pin support for printed circuit boards

 

NEW: Up to 17% higher performance

SIPLACE TX

Faster, smaller, more advanced – the new high-end placement solution

 

The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.

 

NEW for the SIPLACE TX: SIPLACE Tray Unit

 

SIPLACE Tray Unit enables non-stop feeding of components in a tray with a compact design. Maximum flexibility characterized by the following points:

 

Productivity: Non-stop refilling, fast carrier changeover

Storage capacity: 30 levels in main storage+ 12 levels in cache storage

Large tray capacity: 355mm x 275mm (2x JEDEC per level )

Footprint: Minimized protrusion

Random setup: RFID on each layer

Clarity: LED indicator for each level